Bond testing and flaw detection in laminated and composite structures demand a method that sees what ultrasound alone can miss. Mechanical Impedance Analysis (MIA) detects delaminations, disbonds, and voids in bonded, laminated, and honeycomb components by measuring changes in mechanical impedance as a spring-loaded sensor scans the surface — dry, with no coupling liquid.
The A1610 BondVisor is a handheld MIA flaw detector for non-destructive testing of multilayer laminates, fiber-laminate materials, laminate-to-honeycomb and laminate-to-metal bonds, metal-to-metal bonds, soldering, brazing, foams, and wood laminates. It finds impact damage, hail and lightning strike damage, heat-induced strength loss, thickness variations, and osmosis damage in fiberglass — defects common in aerospace, marine, wind energy, and transportation.
Rapid start-up means operators need no extensive training, in-field automatic calibration keeps measurements reliable on rough or uneven surfaces, and long battery life covers full inspection shifts. For quality control of bonded joints and composite structures where adhesive integrity is safety-critical, the A1610 BondVisor delivers fast, dependable flaw detection.
